Rhino Pi IQ9N
Product Overview
The Rhino Pi IQ9N is a high-performance computing device designed for AI NAS and edge intelligence scenarios, built on the Qualcomm IQ9075 platform. The IQ9075 main chip integrates an octa-core Kryo CPU, an Adreno 663 GPU, and a 100 TOPS NPU, delivering powerful AI inference and multimedia processing capabilities in a compact form factor.
The board carries 36GB of LPDDR5 memory and 128GB of UFS 3.1 storage. Through a USB 3.0 to dual SATA bridge chip it can be expanded with 2 SATA 3.0 drives, and together with the M.2 NVMe slot it meets high-capacity local storage requirements. It is suitable for scenarios such as AI NAS, industrial control, intelligent inspection, surveillance equipment, and edge AI boxes.
With its rich external interfaces (2.5G Ethernet port, HDMI 2.0, USB 3.0 Type-A/Type-C, 4-lane MIPI-DSI display output, etc.), the IQ9N can be used directly for system integration in industries such as digital signage, touch interaction, consumer electronics, and entertainment systems.
Operating Systems
The Rhino Pi IQ9N supports the following operating systems. See the corresponding sections for details:
- Ubuntu OS : Ubuntu 24.04, providing a complete Linux environment and AI development capabilities
Product Appearance
For detailed dimension information, please contact the manufacturer to request the DXF document.
Product Specifications
| Item | Specification |
|---|---|
| Product Number | A9075E01 |
| Platform | Qualcomm IQ9075 (QCS9075M) |
| CPU | Octa-core Kryo Gen 6 CPU (Octa-core @ 2.36 GHz) |
| Real-time Cores | 4x Cortex-R52 |
| GPU / VPU | Adreno 663 @ 800 MHz / Adreno 765 |
| NPU | Dual Hexagon tensor processors, 100 TOPS (INT8 dense) / 200 TOPS (INT8 sparse) |
| ISP | Spectra 690 |
| Operating System | Ubuntu 24.04 |
| RAM | 36GB LPDDR5 (3200 MHz, 96-bit, inline ECC) |
| Storage | 128GB UFS 3.1 |
| Video Codec | Decode: 4 x 4K@60fps or 4K@240fps, AV1/HEVC/H.264 Encode: 2 x 4K@60fps or 4K@120fps, HEVC/H.264 |
| Storage Expansion | M.2 Key-M x1 (PCIe 4.0 x4, NVMe SSD), SATA III x2 (USB 3.0 bridge), Micro SD x1 |
| Camera | ZIF-CAMERA connector (4-lane MIPI CSI); reserved interface, not yet supported |
| Display Output | HDMI 2.0 x1 (up to 4K@60fps), 4-lane MIPI-DSI x1 |
| Wireless | Wi-Fi 6: 802.11a/b/g/n/ac/ax, 2.4G / 5G dual-band, 2x2 MIMO Bluetooth: 5.3 |
| USB | USB 3.0 Type-A x2 (onboard); ZIF-USB breakout x2 (USB 3.0 Type-A x1, USB Type-C x1) |
| Ethernet | RJ45 2.5G x1 (dedicated PHY, 10/100/1000/2.5G, TSN ready) |
| Industrial Bus | 8 x CAN-FD (isolation optional); multiple UART / I2C / SPI (3.3V and 1.8V dual-level domains) |
| Audio | 4-channel digital microphone input; stereo amplifier output (dual 5W drive capability) The AEC interface supports a microphone array (the microphone array is not included as standard) |
| Power | 2.5mm DC POWER JACK, standard 19V / 65W; typical power consumption during AI operation about 20W |
| Operating Temperature | Board -20℃ ~ +60℃ |
| Dimensions | Enclosure 134mm x 115mm; board 65mm x 65mm |
Note: The operating temperature is a board-level parameter; the dimensions are given for both the enclosure and the board.
Interface Description
| Interface Name | Model / Connector | Function Description |
|---|---|---|
| Power DC Jack | 2.5mm DC POWER JACK | Power input, standard 19V |
| Fan Connector | WAFER-GH1.25-2PLB | Supports 5V or 12V fans; voltage selected via resistor, 5V by default |
| HDMI | Standard HDMI connector | Standard HDMI signal output |
| USB 3.0 | USB TYPE-A / USB Type-C | Exposes 2 onboard USB 3.0 Type-A ports and 2 ZIF-USB breakout ports (1 Type-A, 1 Type-C); 1 internal port can be converted to 2 SATA ports |
| USB 2.0 | Dual-layer USB TYPE-A | 2 external ports; 2 internal ports, one used for audio AEC noise reduction and one reserved |
| Ethernet Port | RJ45 | 2.5G Ethernet interface |
| Power Button & System LED | Illuminated button | Power switch and system status indication |
| Boot Buttons | — | CPU BOOT x1, RTSS BOOT x1 |
| SATA | Standard SATA connector | SATA III x2, exposed via USB 3.0 bridge |
| M.2 Key-M | M.2 slot | PCIe 4.0 x4, supports NVMe SSD |
| T-Flash | Micro SD card slot | 4-bit, supports SD3.0 / SDR104, dual-level capable |
| RTC Battery | RTC-BAT | Clock backup battery connector |
| Antenna | ANT x2 | Wi-Fi / Bluetooth antenna connector (IPEX Gen 1 RF connector) |
| ZIF-CAMERA | FPC-05F-22PH20 | Camera connector, 4-lane MIPI CSI (reserved, not yet supported) |
| ZIF-USB | FH26W-39S-0.3SHW(60) | USB expansion connector |
| ZIF-LCM&TP | FH26W-39S-0.3SHW(60) | Display and touch panel connector; recommended LCM model: Yuxi Technology YX86801ACT |
| CPU-SPI | WAFER-GH1.25-6PLB | CPU SPI interface (VCC_3V3 / MISO / MOSI / CLK / CS / GND) |
| RTSS-SPI | WAFER-GH1.25-6PLB | RTSS SPI interface |
| AEC | WAFER-GH1.25-4PLB | Used with USB 2.0, supports AEC noise reduction and microphone array |
| SPK x2 | WAFER-PH2.0-2PWB | 2 x 5W speaker connector |
| USB 2.0 (Internal) | WAFER-GH1.25-4PLB | Internal USB 2.0 interface (VBUS / DM / DP / GND) |
| I2S | WAFER-GH1.25-4PLB | Audio interface (DATA / SCK / WS / GND) |
| CPU-DBG / CPU-UART | WAFER-GH1.25-4PLB | CPU debug UART and functional UART, 3.3V level |
| RTSS-DBG / RTSS-UART | WAFER-GH1.25-4PLB | RTSS debug UART and functional UART, 3.3V level |
Notes
- Relative humidity: 0 ~ 95%, non-condensing
- Operating temperature: -20℃ ~ +60℃
- Storage temperature: -40℃ ~ +85℃
- This product is not designed with ESD protection; ESD protection must be designed on the carrier board
- Pay attention to level matching when designing external interfaces
- For high-speed signal interfaces, handle layout routing according to the design requirements to ensure interface performance
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