Module Specifications
SoC Platform
The Rhino Core Q85 intelligent module is built on the Qualcomm QCS8550 platform in a 1581 MPSP package. The chip measures 15.6 × 14.0 × 0.56mm and is manufactured with a 4nm process.
| Item | Parameters |
|---|---|
| AI Performance | 48 TOPS (INT8) / 12 TOPS (FP16) |
| CPU | 1× Kryo Prime @ 3.2GHz + 2× Kryo Gold @ 2.8GHz + 3× Kryo Silver @ 2.0GHz |
| GPU | Adreno 740 |
| Process | 4nm |
| Video Decoding | 4K@240fps / 8K@60fps (H.264 / H.265 / VP9) |
| Video Encoding | 4K@120fps / 8K@30fps (H.264 / H.265) |
Storage
| Item | Parameters |
|---|---|
| RAM | LPDDR5X, up to 4266MHz, 12GB by default, up to 24GB |
| ROM | UFS 4.0 Gear 5 Rate A, 1×2 lane, 128GB by default, up to 512GB |
RAM Notes
RAM is connected to LPDDR5X in PoP form via the EBI controller. 12GB LPDDR5X is populated by default and can be expanded up to 24GB.
ROM Notes
The UFS interface supports up to UFS 4.0 Gear 5 Rate A. A single SK hynix 128GB UFS is populated by default and can be expanded up to 512GB.
Power Supply
The core board uses the Qualcomm PMIC power solution to meet system power supply and CPU power-up/down sequencing requirements.
| Item | Parameters |
|---|---|
| Power Input Method | DC power input |
| Typical Supply Voltage | 3.8V |
| Supply Voltage Range | 3.5V ~ 4.2V (VBATT) |
| USB Charging Voltage | 3.7V ~ 21.5V (USB_VBUS, supports QC5.0 fast charging) |
Power Consumption
Note
Actual power consumption varies depending on workload, peripheral configuration, ambient temperature, and other factors. For power consumption data of typical scenarios, contact APLUX FAE: noah.yang@aidlux.com.
Environmental Adaptability
| Item | Parameters |
|---|---|
| Operating Temperature | -25°C ~ 50°C |
| Storage Temperature | -30°C ~ 80°C |
| Relative Humidity | 0% ~ 95% (non-condensing) |
Product Lifecycle
Lifecycle
The Rhino Core Q85 intelligent module is a long-term supply product. For specific product lifecycle and supply assurance, contact the APLUX sales team for the latest information.