Rhino Core Q64 Smart Module
The Rhino Core Q64 smart module is built on the Qualcomm QCS6490 platform, delivering 12 TOPS of AI computing power. With a PCBA form factor of 40mm × 40mm (board thickness 1.0mm), it integrates LPDDR5 memory and eMMC 5.1 storage, making it suitable for high-computing, high-stability scenarios such as industrial control, intelligent inspection, surveillance devices, and edge AI boxes, and applicable to digital signage, touch interaction, consumer electronics, and entertainment systems.
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Core Specifications
| Category | Description |
|---|---|
| SoC | QCS6490, 1287 PSP package |
| AI Performance | 12 TOPS |
| CPU | 1× Kryo Prime @ 2.7GHz + 3× Kryo Gold @ 2.4GHz + 4× Kryo Silver @ 1.9GHz |
| GPU | Adreno 643 |
| RAM | LPDDR5, up to 3200MHz, 8GB by default, up to 16GB |
| Storage | eMMC 5.1, 64GB by default |
| Power Supply | DC 3.5V ~ 4.2V (VBATT) |
| Dimensions | PCBA 40mm × 40mm (±0.5mm), board thickness 1.0mm (±10%), mating height 3.0mm |
| Operating System | Ubuntu 24.04 |
Peripheral Resources
| Interface Resource | Quantity | Performance |
|---|---|---|
| CSI | 4 | 4 groups of 4-lane, supports D/C PHY |
| SD | 1 | 4-bit, supports SD3.0 and SDR104, dual-level signaling |
| PCIe | 1 | PCIe Gen3 × 1 lane |
| PCIe | 1 | PCIe Gen3 × 2 lane (supports NVMe) |
| DSI | 1 | 4-lane, supports D/C PHY |
| eDP | 1 | 4-lane |
| USB | 2 | 1 USB 3.1 Gen1, up to 5Gbps, supports OTG, DP compatible, 4K60 display; 1 USB 2.0 |
| SPI | 4 | 4 general-purpose SPI |
| UART | 8 | 1 debug, 1 4-wire, 6 2-wire |
| I2C | 9 | 4 camera-dedicated I2C, 2 general-purpose I2C, 3 sensor I2C |
| I2S | 2 | 1 non-LPI I2S, 1 LPI I2S |
| SWR | 1 | Supports PCM/PDM/DATA data formats |
| GPIO | 62 | 62 GPIO resources |
| ADC | 2 | 2 ADC, voltage range 0~1.875V, sampling rate 4.8MHz |
| PWM | 2 | PWM interfaces from PM7350C |
Quick Access
Module SpecificationsSoC platform, storage, power supply, power consumption and environmental adaptability
Interfaces & PinsConnector pin definitions and interface descriptions
Power & BootPower supply solutions and boot process
Mechanical & Thermal DesignModule mechanical dimensions and thermal design reference
Carrier Board DesignCarrier board hardware design guide and reference circuits
ResourcesFirmware, tool software and design document downloads
FAQ & TroubleshootingCommon issues and solutions
Release NotesFirmware and documentation update history