Rhino Core Q85 Intelligent Module

The Rhino Q85 intelligent module (Rhino Core Q85) is built on the Qualcomm QCS8550 platform with a 4nm process, delivering up to 48 TOPS (INT8) of AI computing power. With a compact form factor (15.6 × 14.0 × 0.56mm), it integrates LPDDR5X memory and UFS 4.0 storage, making it suitable for high-computing, high-stability scenarios such as robotics, industrial AI, and high-end IPC/VR applications.

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Core Specifications

Category	Specification
SoC	QCS8550 (A8550), 1581 MPSP package, 4nm process
AI Performance	48 TOPS (INT8) / 12 TOPS (FP16)
CPU	1× Kryo Prime @ 3.2GHz + 2× Kryo Gold @ 2.8GHz + 3× Kryo Silver @ 2.0GHz
GPU	Adreno 740
RAM	LPDDR5X, up to 4266MHz, 12GB by default, up to 24GB
Storage	UFS 4.0, 128GB by default, up to 512GB
Power Supply	DC 3.5V ~ 4.2V (VBATT)
Dimensions	15.6 × 14.0 × 0.56mm
Operating System	Android 15 / Ubuntu 22.04

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Module Specifications

SoC platform, storage, power, power consumption, and environmental adaptability

Interfaces & Pins

Connector pin definitions and interface descriptions

Power & Boot

Power supply scheme and boot process

Mechanical & Thermal Design

Module mechanical dimensions and thermal design reference

Carrier Board Design

Carrier board hardware design guide and reference circuits

Resources

Firmware, tool software, and design material downloads

FAQ & Troubleshooting

Frequently asked questions and solutions

Release Notes

Firmware and documentation update records