Rhino Core Q85 Intelligent Module
The Rhino Q85 intelligent module (Rhino Core Q85) is built on the Qualcomm QCS8550 platform with a 4nm process, delivering up to 48 TOPS of AI computing power. With a PCBA form factor of 40mm × 40mm (board thickness 1.0mm), it integrates LPDDR5X memory and UFS 4.0 storage, making it suitable for high-computing, high-stability scenarios such as robotics, industrial AI, high-end IPC/VR, and automotive applications.
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Core Specifications
| Category | Specification |
|---|---|
| SoC | QCS8550, 1581 MPSP package, 4nm process |
| AI Performance | 48 TOPS |
| CPU | 1× Kryo Prime @ 3.2GHz + 2× Kryo Gold @ 2.8GHz + 3× Kryo Silver @ 2.0GHz |
| GPU | Adreno 740 |
| RAM | LPDDR5X, up to 4266MHz, 12GB by default, up to 24GB |
| Storage | UFS 4.0, 128GB by default, up to 512GB |
| Power Supply | DC 3.5V ~ 4.2V (VBATT) |
| Dimensions | PCBA 40mm × 40mm (±0.5mm), board thickness 1.0mm (±10%), mating height 3.0mm |
| Operating System | Ubuntu 22.04 |
Peripheral Resources
| Interface Resource | Quantity | Performance |
|---|---|---|
| CSI | 5 | 4 groups of 4-lane + 1 group of 2-lane, DPHY V1.2 2.5Gbps/lane, CPHY v2.0 13.68Gbps/trio |
| SD | 1 | 4-bit, supports SD3.0 and SDR104, 1.2V I/O level only |
| PCIe | 1 | PCIe 3.0, 2-lane, 8Gbps |
| PCIe | 1 | PCIe 4.0, 2-lane, 16Gbps |
| DSI | 2 | 2 groups of 4-lane, up to 3480×2160@120Hz, 3360×1600@144Hz |
| USB | 1 | USB 3.1 Gen2, up to 10Gbps, supports OTG, DP 1.4 compatible, supports MST mode, optional 2×4K60-10bit or 1×8K30-DSC |
| SPI | 5 | 4 general-purpose SPI + 1 dedicated SPI, master mode only |
| UART | 10 | 1 debug, 1 4-wire, 8 2-wire |
| I2C | 9 | 4 camera-dedicated I2C, 4 general-purpose I2C, 1 sensor I2C |
| I2S | 2 | 1 non-LPI I2S, 1 LPI I2S |
| SWR | 1 | Supports PCM/PDM/DATA data formats |
| GPIO | 50 | 50 GPIO resources |
| ADC | 2 | 2 ADC, voltage range 0~1.875V, sampling rate 4.8MHz |
| PWM | 2 | PWM interfaces from PM8550 |
Quick Access
SoC platform, storage, power, power consumption, and environmental adaptability
Connector pin definitions and interface descriptions
Power supply scheme and boot process
Module mechanical dimensions and thermal design reference
Carrier board hardware design guide and reference circuits
Firmware, tool software, and design material downloads
Frequently asked questions and solutions
Firmware and documentation update records