Rhino Pi X1R Carrier Board Introduction
Product Overview
The Rhino Pi X1R carrier board is compatible with both the Rhino Core Q85 and Rhino Core Q64 smart modules. The carrier board provides dual Gigabit RJ45 network ports, USB 3.0 Type-A and expansion USB 2.0 connectors, as well as display interfaces such as MIPI DSI/CSI, HDMI, and eDP. It also supports multiple general-purpose bus interfaces including SPI, I2C, RS485, UART, I2S, CAN, and GPIO.
An onboard WiFi 6 + BT 5.3 module, a standard Mini-PCIe interface for 4G communication expansion, a Micro SD card slot for external storage expansion, and audio input/output interfaces are also provided. The board is designed for high-compute and high-stability scenarios such as robotics, industrial AI, and high-end IPC/VR applications.
Product Appearance
Photo of the Rhino Pi X1R mainboard: 
Interface Diagram
Physical Dimensions
| Item | Parameter |
|---|---|
| PCBA dimensions | 135mm × 90mm (±0.5mm) |
| Board thickness | 1.6mm (±10%) |
| Mounting hole diameter | 6mm |
| Screw hole specification | ∮3.2mm × 4 (±10%) |
| Overall dimensions (including components) | 135mm × 90mm × 14mm, PCB front height 9mm |
For detailed dimension information, contact the APLUX FAE at noah.yang@aidlux.com.
Specification List
| Category | Specification |
|---|---|
| Core Board | Rhino Core Q85 smart module (QCS8550) |
| TF Card | Push-push TF card socket, supports up to 256GB |
| USB | 2 Type-A (USB 3.0 ×2), 4 built-in 1.25mm vertical connectors (USB 2.0 ×4), 4 2.0mm horizontal connectors (USB 2.0 ×4) |
| HDMI | Standard HDMI display interface, supports 4K@60Hz output |
| eDP | Industry-standard 30-pin eDP socket |
| MIPI DSI | 4-Lane MIPI DSI display interface |
| Touch | FPC interface, supports I2C touch |
| Camera | 2× MIPI CSI × 4-lane |
| I2S | 1× I2S interface, supports low-power voice processing and audiophile-grade audio playback (4 microphones) |
| Ethernet | 2× 10/100/1000M auto-negotiation RJ45 network ports |
| Mini-PCIe | Industry-standard m-PCIe 4G module interface |
| SIM Card | Push-push Nano SIM card socket, supports mobile communication |
| CAN | 2× CAN pin header interfaces |
| Headphone/Mic | Supports US-standard 4-pole headset 3.5mm jack (left-right-ground-mic) |
| SPI | 2× independent SPI pin header interfaces |
| GPIO | Supports 10 external 1.8V GPIO expansion |
| Serial Communication | 2× RS485 + 6× UART |
| Button | Flashing button (RECOVERY) + power button |
| Power Input | Supports 10~24V wide voltage DC input (12V/3A recommended) |
| Debug Interface | Supports external 3.3V serial debug |
| Line Output | Standard left/right channel line output (pin header interface + headphone interface) |
| WiFi / Bluetooth | Onboard WiFi 6 + BT 5.3 |
| Environmental Requirements | Operating temperature -25°C ~ 50°C, storage temperature -40°C ~ 85°C, operating humidity 0%~95% (non-condensing) |
Functions and Interface Definitions
USB 2.0 Interfaces (J8 / J9 / J10 / J11)
J8, J9, J10, and J11 are USB 2.0 HOST interfaces, all routed through the PCIe-to-USB chip uPD720201K8. Each interface has an independent load switch with a load capability of 1.2A. The connector type is a 1×4×2.0mm latching connector, manufactured by TXGA, model FWF20029-S04B25NAM.
Pin Definitions:
| Pin# | Definition | Note |
|---|---|---|
| 1 | 5V | 5V output |
| 2 | DM | USB differential data - |
| 3 | DP | USB differential data + |
| 4 | GND | Digital ground |
USB 2.0 Interfaces (J12 / J13 / J14 / J15)
J12, J13, J14, and J15 are USB 2.0 HOST interfaces, all routed through the USB HUB chip FE1.1, so they share a 480Mbps bandwidth. J12 and J13 share one load switch, and J14 and J15 share another load switch, with a maximum load capability of 1.2A for the two USB interfaces. The connector type is a 1×4×1.25mm latching connector, manufactured by Xunpu, model WAFER-GH1.25-4PLB.
Pin Definitions:
| Pin# | Definition | Note |
|---|---|---|
| 1 | 5V | 5V output |
| 2 | DM | USB differential data - |
| 3 | DP | USB differential data + |
| 4 | GND | Digital ground |
eDP Socket (J18)
【J18】Standard eDP socket (1×30×0.5mm), supports the eDP v1.4 standard. The connector is a bottom-contact, front-flip FPC connector, manufactured by Xunpu, model FPC-05F-30PH20.
Pin Definitions:
| Pin# | Definition | Note |
|---|---|---|
| 1 | NC | NC |
| 2 | GND | Digital ground |
| 3 | D1- | Differential data signal |
| 4 | D1+ | Differential data signal |
| 5 | GND | Digital ground |
| 6 | D0- | Differential data signal |
| 7 | D0+ | Differential data signal |
| 8 | GND | Digital ground |
| 9 | AUX+ | Differential auxiliary signal |
| 10 | AUX- | Differential auxiliary signal |
| 11 | GND | Digital ground |
| 12 | LCD_3V3 | LCD_3V3 power output |
| 13 | LCD_3V3 | LCD_3V3 power output |
| 14 | NC | NC |
| 15 | GND | Digital ground |
| 16 | GND | Digital ground |
| 17 | ETX_HPD | Detection signal |
| 18 | GND | Digital ground |
| 19 | GND | Digital ground |
| 20 | GND | Digital ground |
| 21 | GND | Digital ground |
| 22 | BL_EN | Enable signal |
| 23 | BL_PWM | PWM control signal |
| 24 | NC | NC |
| 25 | NC | NC |
| 26 | BL_12V | BL_12V power output |
| 27 | BL_12V | BL_12V power output |
| 28 | BL_12V | BL_12V power output |
| 29 | BL_12V | BL_12V power output |
| 30 | NC | NC |
Backlight Socket (J20)
【J20】Backlight socket (1×6×2.0mm), provides 12V backlight power. It is recommended that backlight power exceeding 20W be supplied by a separate backlight power board (the 12V adapter supplies power directly; a 24V adapter requires adjustment of the onboard power). It supports PWM-controlled backlight and backlight on/off. The connector is manufactured by Bossie, model BX-PH2.0-6PWZ-R.
Pin Definitions:
| Pin# | Definition | Note |
|---|---|---|
| 1 | GND | Digital ground |
| 2 | GND | Digital ground |
| 3 | PWM | PWM control signal |
| 4 | BL_ON/OFF | Backlight on/off signal |
| 5 | BL_12V | 12V power output |
| 6 | BL_12V | 12V power output |
Camera Socket (J22 / J23)
J22 and J23 are camera sockets with identical signal definitions. Both support MIPI 4-Lane CSI with a maximum of 2.5Gbps/lane. The connector type is a 1×22×0.5mm front-flip FPC connector, manufactured by Xunpu, model FPC-05F-22PH20.
Pin Definitions:
| Pin# | Definition | Note |
|---|---|---|
| 1 | GND | Digital ground |
| 2 | LN0_M | Differential data signal |
| 3 | LN0_P | Differential data signal |
| 4 | GND | Digital ground |
| 5 | LN1_M | Differential data signal |
| 6 | LN1_P | Differential data signal |
| 7 | GND | Digital ground |
| 8 | CLK_M | Differential clock signal |
| 9 | CLK_P | Differential clock signal |
| 10 | GND | Digital ground |
| 11 | LN2_M | Differential data signal |
| 12 | LN2_P | Differential data signal |
| 13 | GND | Digital ground |
| 14 | LN3_M | Differential data signal |
| 15 | LN3_P | Differential data signal |
| 16 | GND | Digital ground |
| 17 | RST | Reset signal |
| 18 | LED | LED signal |
| 19 | GND | Digital ground |
| 20 | SCL | I2C bus clock signal |
| 21 | SDA | I2C bus data signal |
| 22 | CAM_3V3 | 3.3V power output |
CAN Socket (J27 / J28)
J27 and J28 are CAN connectors with identical signal definitions. Both support CAN 2.0B and CAN FD. The connector type is 1×3×2.5mm, manufactured by TXGA, model FWF25029-S03S25W5M.
Pin Definitions:
| Pin# | Definition | Note |
|---|---|---|
| 1 | H | Data |
| 2 | L | Data |
| 3 | VSS | CAN shield ground |
RS485 Interfaces (J37 / J38)
【J37】【J38】are RS485 interfaces (1×4×1.25mm) with identical signal definitions, both with onboard 120Ω termination resistors. The connector is manufactured by Xunpu, model WAFER-GH1.25-4PLB.
Signal Definitions:
| Pin# | Definition | Note |
|---|---|---|
| 1 | VCC | 3.3V power output |
| 2 | B | Differential signal |
| 3 | A | Differential signal |
| 4 | VSS | RS485 shield ground |
Notes
Please pay attention to the following key points when assembling and using the Rhino Pi X1R carrier board:
- Environmental requirements: Relative humidity 0~95% non-condensing, operating temperature -25°C ~ 50°C, storage temperature -40°C ~ 85°C.
- ESD protection: ESD protection is required during assembly and transportation of the complete product.
- Cables: The interface cables of this board should not be too long; otherwise, signal quality may be affected.
- Mechanical stress: Do not twist or press the board during assembly to avoid deformation.
- Short circuit prevention: Never allow a short circuit between the bare board and other peripherals.
- LCD connection: When connecting an external eDP LCD, check whether the driving voltage and current meet the requirements, and pay attention to pin 1 orientation of the screen cable socket.
- Backlight power supply: When connecting an external eDP LCD, check whether the backlight voltage and current meet the requirements. If the LCD backlight power exceeds 20W, it is recommended to use a separate power board for backlight power supply.
- Peripheral IO level and current: When connecting external devices to the peripheral interfaces (USB, GPIO, serial ports, I2C, SPI, HDMI, etc.), check whether the IO level and current of the peripheral meet the requirements. When using the power pins on the mainboard connectors to power peripherals, the current of regular power pins must not exceed 100mA. When connecting a serial port to a peripheral, level matching is also required (1.8V level, 3.3V TTL level, and RS-485 level).
Document Information
- Official product name: Rhino Pi X1R
- Full product code: Rhino Pi X1R
- Document version: V1.0
- Release date: 2026-06-11
- Classification: Public
- Scope of application: Rhino Pi X1R mainboard and complete product integration projects based on this hardware platform
© 2026 APLUX Intelligent Technology Co., Ltd. No unauthorized copying, distribution, or use beyond the scope agreed in this document.