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Module Specifications

SoC Platform

The Rhino Core Q64 smart module is built on the Qualcomm QCS6490 platform in a 1287 PSP package, with a chip size of 14.0 × 12.0 × 0.91 mm.

ItemParameter
AI Performance12 TOPS
CPU1× Kryo Prime @ 2.7GHz + 3× Kryo Gold @ 2.4GHz + 4× Kryo Silver @ 1.9GHz
GPUAdreno 643
Video Decode4K@60fps (H.264 / H.265 / VP9)
Video Encode4K@30fps (H.264 / H.265)

Memory & Storage

ItemParameter
RAMLPDDR5, up to 3200MHz, 8GB by default, up to 16GB supported
ROMeMMC 5.1, 64GB by default

RAM Notes

RAM is connected to the LPDDR5 via the EBI controller. 8GB LPDDR5 is populated by default and can be expanded up to 16GB.

ROM Notes

The core board supports eMMC 5.1, with a single 64GB eMMC populated by default.

Power Supply

The core board uses the Qualcomm PMIC power solution (PM7325 / PM7350C / PM7250B) to meet the system power supply and CPU power-up/power-down sequencing requirements.

ItemParameter
Power Supply MethodDC power supply
Typical Supply Voltage3.8V
Supply Voltage Range3.5V ~ 4.2V (VBATT)
Peak CurrentUp to 7A with CPU and GPU at full load
USB Charging Voltage3.7V ~ 12.6V (USB_VBUS, supports QC5.0 fast charging)

Power Supply Notes

When powered by battery, ensure sufficient capacitance on VBAT on the carrier board (at least two 47μF capacitors recommended) and protection with a 5.1V / 500mW TVS diode.

Power Consumption

Note

Actual power consumption varies with workload, peripheral configuration, ambient temperature and other factors. For typical-scenario power consumption data, please contact the APLUX FAE team: noah.yang@aidlux.com.

Environmental Adaptability

ItemParameter
Operating Temperature-25°C ~ 50°C
Storage Temperature-40°C ~ 85°C
Relative Humidity0% ~ 95% (non-condensing)

Product Lifecycle

Lifecycle

The Rhino Core Q64 smart module is a long-term supply product. For the latest product lifecycle and supply assurance information, please consult the APLUX sales team.